Interconnection technologies for multichip assemblies (ITMA)-A UK Information Technology Engineering Directorate hybrid wafer scale project

Author

Pedder, David J.

Author_Institution

GEC Plessey Semicond., Swindon, UK

fYear

1993

fDate

1993

Firstpage

95

Lastpage

106

Abstract

The Interconnection technology for multichip assemblies (ITMA) project is addressing the application of a silicon-substrate-based multichip module (MCM) technology to the requirements of parallel computing applications in the UK. The program involves activities on MCM design methodology, silicon substrate process technology, device assembly, module packaging technology, the design of VLSI devices specifically for MCM applications, and the implementation of advanced MCM demonstrator modules in parallel computing systems. The objectives of the ITMA project are described, and the technologies employed within the project to realize high-performance MCMs and hybrid wafer scale integration (HWSI) modules are reviewed.

Keywords

VLSI; assembling; multichip modules; packaging; parallel architectures; ITMA; Si; VLSI devices; demonstrator modules; device assembly; hybrid wafer scale integration; interconnection technology; module packaging; multichip assemblies; multichip module; parallel computing; substrate process technology; Assembly; Design methodology; Dielectric substrates; Information technology; Integrated circuit interconnections; Packaging; Parallel processing; Silicon; Testing; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Wafer Scale Integration, 1993. Proceedings., Fifth Annual IEEE International Conference on

Conference_Location

San Francisco, CA, USA

Print_ISBN

0-7803-0867-0

Type

conf

DOI

10.1109/ICWSI.1993.255269

Filename

255269