Reliability of low-k interconnect dielectrics

Summary form only given. The talk will be divided in two: Part1: Statistics of BEOL dielectric breakdown • Is the Weibull distribution still viable when the line edge roughness is large in respect to the line-spacing? • Stress dependence of distributions. • Meanings of observed statistical parameters and how to extract the actual parameters that are needed for extrapolation to low failure probabilities at usage conditions.