• DocumentCode
    3434827
  • Title

    On the correlation between NBTI, SILC, and flicker noise

  • Author

    Wagner, P.-J. ; Kaczer, Ben ; Scholten, A. ; Reisinger, H. ; Bychikhin, S. ; Pogany, Dionyz ; Vandamme, L.K.J. ; Grasser, Tibor

  • Author_Institution
    Inst. for Microelectron., Tech. Univ. Wien, Vienna, Austria
  • fYear
    2012
  • fDate
    14-18 Oct. 2012
  • Firstpage
    60
  • Lastpage
    64
  • Abstract
    Negative Bias Temperature Instability (NBTI) is suspected to be linked to various other MOSFET phenomena. We report measurements of increased drain current noise, increased gate leakage current, and decreased recoverable threshold voltage shift after multiple cycles of negative bias temperature stress and relaxation for three different technologies. We also find that stress conditions have to be carefully selected, otherwise oxide breakdown will be erroneously interpreted as a correlation between NBTI, noise and gate leakage. Finally, the implications of our findings on the modelling of oxide defects are highlighted.
  • Keywords
    MOSFET; flicker noise; leakage currents; negative bias temperature instability; semiconductor device breakdown; semiconductor device measurement; semiconductor device models; semiconductor device noise; MOSFET; NBTI; SILC; drain current noise; flicker noise; gate leakage current; negative bias temperature instability; oxide breakdown; oxide defects modelling; recoverable threshold voltage shift; stress conditions; stress-induced leakage current; Correlation; Current measurement; Logic gates; Noise; Noise measurement; Reliability; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report (IRW), 2012 IEEE International
  • Conference_Location
    South Lake Tahoe, CA
  • ISSN
    1930-8841
  • Print_ISBN
    978-1-4673-2749-7
  • Type

    conf

  • DOI
    10.1109/IIRW.2012.6468921
  • Filename
    6468921