DocumentCode
3434827
Title
On the correlation between NBTI, SILC, and flicker noise
Author
Wagner, P.-J. ; Kaczer, Ben ; Scholten, A. ; Reisinger, H. ; Bychikhin, S. ; Pogany, Dionyz ; Vandamme, L.K.J. ; Grasser, Tibor
Author_Institution
Inst. for Microelectron., Tech. Univ. Wien, Vienna, Austria
fYear
2012
fDate
14-18 Oct. 2012
Firstpage
60
Lastpage
64
Abstract
Negative Bias Temperature Instability (NBTI) is suspected to be linked to various other MOSFET phenomena. We report measurements of increased drain current noise, increased gate leakage current, and decreased recoverable threshold voltage shift after multiple cycles of negative bias temperature stress and relaxation for three different technologies. We also find that stress conditions have to be carefully selected, otherwise oxide breakdown will be erroneously interpreted as a correlation between NBTI, noise and gate leakage. Finally, the implications of our findings on the modelling of oxide defects are highlighted.
Keywords
MOSFET; flicker noise; leakage currents; negative bias temperature instability; semiconductor device breakdown; semiconductor device measurement; semiconductor device models; semiconductor device noise; MOSFET; NBTI; SILC; drain current noise; flicker noise; gate leakage current; negative bias temperature instability; oxide breakdown; oxide defects modelling; recoverable threshold voltage shift; stress conditions; stress-induced leakage current; Correlation; Current measurement; Logic gates; Noise; Noise measurement; Reliability; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report (IRW), 2012 IEEE International
Conference_Location
South Lake Tahoe, CA
ISSN
1930-8841
Print_ISBN
978-1-4673-2749-7
Type
conf
DOI
10.1109/IIRW.2012.6468921
Filename
6468921
Link To Document