Title :
A wafer scale visual-to-thermal converter
Author :
Syrzycki, M.J. ; Carr, L. ; Chapman, G.H. ; Parameswaran, M.
Author_Institution :
Sch. of Eng. Sci., Simon Fraser Univ., Burnaby, BC, Canada
Abstract :
Wafer scale transducer arrays (WSTAs) containing multi-transducer arrays combined with processing circuits are produced using a combination of CMOS technology, silicon micromachining and laser interconnection techniques. A prototype wafer scale visual-to-thermal converter is being developed to convert a visual scene to thermal scene with the same resolution. The basic array is composed of transducer pixels, which combine photodetectors and thermal emitters as transducers, together with signal conditioning and control circuitry. The WSTA redundancy approach is driven by regularity in transducer location and emphasizes local over global transducer sparing.
Keywords :
CMOS integrated circuits; VLSI; image convertors; photodetectors; CMOS technology; control circuitry; laser interconnection techniques; local transducer sparing; multi-transducer arrays; photodetectors; redundancy approach; signal conditioning; silicon micromachining; thermal emitters; transducer location; transducer pixels; wafer scale visual-to-thermal converter; CMOS process; CMOS technology; Integrated circuit interconnections; Layout; Micromachining; Optical arrays; Prototypes; Signal resolution; Silicon; Transducers;
Conference_Titel :
Wafer Scale Integration, 1993. Proceedings., Fifth Annual IEEE International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-0867-0
DOI :
10.1109/ICWSI.1993.255279