Title :
1993 Proceedings. Fifth Annual IEEE International Conference on Wafer Scale Integration (Cat. No.93CH3227-6)
Abstract :
The following topics are dealt with: wafer scale integration (WSI) devices; WSI architecture; WSI application potential; WSI design issues; WSI testing and reconfiguration; WSI power, clock and signal distribution; WSI technology; and the interconnection technologies for multichip assemblies
Keywords :
VLSI; integrated circuit technology; integrated circuit testing; multichip modules; packaging; parallel architectures; WSI architecture; clock distribution; design issues; interconnection technologies; multichip assemblies; power distribution; reconfiguration; signal distribution; testing; wafer scale integration;
Conference_Titel :
Wafer Scale Integration, 1993. Proceedings., Fifth Annual IEEE International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-7803-0867-0
DOI :
10.1109/ICWSI.1993.255280
