• DocumentCode
    3434856
  • Title

    Experimental verification of stress compensation in the SBTC-cut

  • Author

    Valdois, Michel ; Sinha, Bikash K. ; Boy, Jean-Jacques

  • Author_Institution
    Schlumberger Ind., Massy, France
  • fYear
    1988
  • fDate
    2-5 Oct 1988
  • Firstpage
    347
  • Abstract
    The SBTC-cut (stress compensated for the B-mode and temperature compensated for the C-mode) was first predicted in 1981 based on theoretical calculations for the force-frequency effect in thickness-shear quartz resonators. The authors have verified experimentally the stress compensation feature for the fast thickness shear mode of vibration of SBTC-cut quartz resonators. The first set of experimental results consists of measurements made on biconvex contoured, disc resonators of orientation in the neighborhood of SBTC-cut as well as on a RT-cut resonator with a different radius of curvature for the contoured faces. For the resonator design used in the cylindrical probe structure, the motional resistance for the B-mode of vibration was approximately 12% of that of the C-mode. In addition, experimental data were obtained on the temperature dependence of the planar stress coefficient and pressure dependence of the frequency-temperature characteristic for both the thickness-shear modes of the SBTC-cut
  • Keywords
    compensation; crystal resonators; quartz; stress analysis; B-mode; C-mode; RT-cut resonator; SBTC-cut; biconvex contoured resonators; cylindrical probe structure; disc resonators; force-frequency effect; frequency-temperature characteristic; motional resistance; planar stress coefficient; pressure dependence; radius of curvature; stress compensation; temperature compensated; temperature dependence; thickness-shear modes; thickness-shear quartz resonators; vibration mode; Fabrication; Frequency; Oscillators; Pressure measurement; Stress; Temperature dependence; Temperature distribution; Temperature sensors; Transducers; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1988. Proceedings., IEEE 1988
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1988.49397
  • Filename
    49397