Title :
A packaging system for built-in microcircuits in multilayer substrates
Author :
Huang, Yu-Jung ; Fang, Fei-Chun ; Hsiau, Kuo-Hong ; Fu, Shen-Li
Author_Institution :
Dept. of Electron. Eng., Kaohsiung Polytech. Inst., Kaohsiung, Taiwan
Abstract :
This paper presents an approach to the development of a packaging system for incorporating passive components such as resistors and capacitors within multilayer substrates. The electrical characteristics of the embedded passive components within the multilayer substrates are analyzed and evaluated by their mathematical models. A heuristic routing algorithm was proposed for the interconnections of the embedded passive components within the multilayer substrates. Experimental results were provided to show that the present proposed system has better performance than a commercial routing tool
Keywords :
circuit layout CAD; integrated circuit interconnections; integrated circuit layout; integrated circuit packaging; network routing; built-in microcircuits; electrical characteristics; embedded passive components; heuristic routing algorithm; interconnections; mathematical models; multilayer substrates; packaging system; Capacitors; Dielectric substrates; Electric variables; Electronics packaging; Geometry; Integrated circuit interconnections; Nonhomogeneous media; Process design; Resistors; Routing;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
Conference_Location :
Omiya
Print_ISBN :
0-7803-3622-4
DOI :
10.1109/IEMT.1995.541086
