DocumentCode
3435080
Title
Bayesian analysis in manufacturing instrumentation for test and evaluation
Author
Ida, Nathan ; Li, Minyan ; Roemer, Louis E.
Author_Institution
Dept. of Electr. Eng., Akron Univ., OH, USA
fYear
1993
fDate
27-28 April 1993
Firstpage
4
Lastpage
13
Abstract
In many test situations, a known measurement is expected or a type of defect can be anticipated. A knowledge of the expected results (a template) allows asking the pertinent question: given the data taken, and given knowledge of the template, what is the probability that the expected object (or event) is present? Two examples of the usefulness of this approach are presented. The first is a test for the presence of wires in tire belting (based on the knowledge of how single wire behaves under the given test). The instrumentation is an eddy current bridge. The second example is testing for a known type of defect in a steel bar. The magnetic field surrounding the bar, when direct current is passed through the bar, is used as the tested quantity; the template is the magnetic field normal to the bar surface, computed by the finite element method (FEM). In both cases, the expected location of the object is identified, along with related information on the tested object. In both cases, the Bayesian approach focuses attention on the question of interest: what is the probability that the test hypothesis is true?.<>
Keywords
Bayes methods; bridge instruments; eddy current testing; fault location; instrumentation; magnetic fields; manufacturing industries; probability; Bayesian approach; FEM; direct current; eddy current bridge; finite element method; magnetic field; manufacturing instrumentation; probability; steel bar defect; tire belting; Bayesian methods; Bridges; Eddy currents; Instruments; Magnetic fields; Manufacturing; Steel; Testing; Tires; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Engineering Problems in the Rubber and Plastics Industries, 1993., IEEE Conference Record of 1993 Forth-Fifth Annual Conference of
Conference_Location
Akron, OH, USA
Print_ISBN
0-7803-0897-2
Type
conf
DOI
10.1109/RAPCON.1993.255316
Filename
255316
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