• DocumentCode
    3435080
  • Title

    Bayesian analysis in manufacturing instrumentation for test and evaluation

  • Author

    Ida, Nathan ; Li, Minyan ; Roemer, Louis E.

  • Author_Institution
    Dept. of Electr. Eng., Akron Univ., OH, USA
  • fYear
    1993
  • fDate
    27-28 April 1993
  • Firstpage
    4
  • Lastpage
    13
  • Abstract
    In many test situations, a known measurement is expected or a type of defect can be anticipated. A knowledge of the expected results (a template) allows asking the pertinent question: given the data taken, and given knowledge of the template, what is the probability that the expected object (or event) is present? Two examples of the usefulness of this approach are presented. The first is a test for the presence of wires in tire belting (based on the knowledge of how single wire behaves under the given test). The instrumentation is an eddy current bridge. The second example is testing for a known type of defect in a steel bar. The magnetic field surrounding the bar, when direct current is passed through the bar, is used as the tested quantity; the template is the magnetic field normal to the bar surface, computed by the finite element method (FEM). In both cases, the expected location of the object is identified, along with related information on the tested object. In both cases, the Bayesian approach focuses attention on the question of interest: what is the probability that the test hypothesis is true?.<>
  • Keywords
    Bayes methods; bridge instruments; eddy current testing; fault location; instrumentation; magnetic fields; manufacturing industries; probability; Bayesian approach; FEM; direct current; eddy current bridge; finite element method; magnetic field; manufacturing instrumentation; probability; steel bar defect; tire belting; Bayesian methods; Bridges; Eddy currents; Instruments; Magnetic fields; Manufacturing; Steel; Testing; Tires; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Engineering Problems in the Rubber and Plastics Industries, 1993., IEEE Conference Record of 1993 Forth-Fifth Annual Conference of
  • Conference_Location
    Akron, OH, USA
  • Print_ISBN
    0-7803-0897-2
  • Type

    conf

  • DOI
    10.1109/RAPCON.1993.255316
  • Filename
    255316