DocumentCode
3435178
Title
Tin whiskers: a case study
Author
McDowell, M.E.
Author_Institution
US Air Force, Los Angeles AFB, CA, USA
fYear
1993
fDate
Jan. 31 1993-Feb. 5 1993
Firstpage
207
Lastpage
215
Abstract
Pure electroplated tin is susceptible to the growth of fibrous whiskers that can produce short circuits and, under some conditions, vacuum metal arcs capable of sustaining hundreds of amps. Typical whiskers are 3-4 mu m in diameter and approach 2 mm in length; they are strong enough to penetrate one layer of conformal coating. The physical and electrical properties of tin whiskers and the reasons for their growth are discussed. A methodology to disposition to use of tin in existing spacecraft hardware is presented. It permits the use of tin when growth conditions are strongly adverse or when the tin-plated components are conformally coated. In cases where whisker growth is considered possible and problematic, removal and replacement, or careful cleaning and conformal coating is required.<>
Keywords
crystal growth; electroplated coatings; surface treatment; tin; whiskers (crystal); cleaning; conformal coating; electroplated Sn; fibrous whiskers; growth; spacecraft hardware; vacuum metal arcs; Circuits; Computer aided software engineering; Electronic components; Hardware; Impurities; Lead; Stress; Surface morphology; Temperature dependence; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Aerospace Applications Conference, 1993. Digest., 1993 IEEE
Conference_Location
Steamboat, CO, USA
Print_ISBN
0-7803-0980-4
Type
conf
DOI
10.1109/AERO.1993.255322
Filename
255322
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