• DocumentCode
    3435178
  • Title

    Tin whiskers: a case study

  • Author

    McDowell, M.E.

  • Author_Institution
    US Air Force, Los Angeles AFB, CA, USA
  • fYear
    1993
  • fDate
    Jan. 31 1993-Feb. 5 1993
  • Firstpage
    207
  • Lastpage
    215
  • Abstract
    Pure electroplated tin is susceptible to the growth of fibrous whiskers that can produce short circuits and, under some conditions, vacuum metal arcs capable of sustaining hundreds of amps. Typical whiskers are 3-4 mu m in diameter and approach 2 mm in length; they are strong enough to penetrate one layer of conformal coating. The physical and electrical properties of tin whiskers and the reasons for their growth are discussed. A methodology to disposition to use of tin in existing spacecraft hardware is presented. It permits the use of tin when growth conditions are strongly adverse or when the tin-plated components are conformally coated. In cases where whisker growth is considered possible and problematic, removal and replacement, or careful cleaning and conformal coating is required.<>
  • Keywords
    crystal growth; electroplated coatings; surface treatment; tin; whiskers (crystal); cleaning; conformal coating; electroplated Sn; fibrous whiskers; growth; spacecraft hardware; vacuum metal arcs; Circuits; Computer aided software engineering; Electronic components; Hardware; Impurities; Lead; Stress; Surface morphology; Temperature dependence; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace Applications Conference, 1993. Digest., 1993 IEEE
  • Conference_Location
    Steamboat, CO, USA
  • Print_ISBN
    0-7803-0980-4
  • Type

    conf

  • DOI
    10.1109/AERO.1993.255322
  • Filename
    255322