• DocumentCode
    3435347
  • Title

    Diffusion along triple junctions is this the pathway for narrow Cu conductor lines?

  • Author

    Lloyd, J.R. ; Adamshick, S. ; Durcan, C. ; Kandel, Y. ; Lund, I.N. ; McGowan, B.T. ; Settens, C.M. ; Zhang, Zhenhao

  • Author_Institution
    Coll. of Nanoscale Sci. & Eng., SUNY Albany, Albany, NY, USA
  • fYear
    2012
  • fDate
    14-18 Oct. 2012
  • Firstpage
    151
  • Lastpage
    153
  • Abstract
    The possibility that the major mass transport pathway in very thin small dimension metallic nanoconductors is explored theoretically. It is seen that if we consider the triple junctions of the grain boundary intersecting with the cap and/or the liner the observations can be accounted for and that the grain boundary is never an important pathway.
  • Keywords
    copper; diffusion; grain boundaries; semiconductor junctions; Cu; diffusion; grain boundary intersection; mass transport pathway; narrow conductor lines; small dimension metallic nanoconductors; triple junctions; Conductors; Electromigration; Energy measurement; Grain boundaries; Junctions; Temperature; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report (IRW), 2012 IEEE International
  • Conference_Location
    South Lake Tahoe, CA
  • ISSN
    1930-8841
  • Print_ISBN
    978-1-4673-2749-7
  • Type

    conf

  • DOI
    10.1109/IIRW.2012.6468943
  • Filename
    6468943
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3435347