Surface integral equations for three dimensional surfaces containing circuit analog sheets

Author

Topsakal, E. ; Volakis, J.L. ; Ross, D.C.

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA

Volume

3

fYear

1999

fDate

11-16 July 1999

Firstpage

1832

Abstract

A circuit analog boundary condition (CABC) is presented along with applications to simulating three dimensional structures. Explicit expressions for the general CABC are given for single/multilayer sheets surface integral equations are then developed on the basis of these boundary conditions for more efficient modeling of non-metallic bulk structures.

Keywords

electromagnetic wave scattering; inhomogeneous media; integral equations; transmission line theory; 3D structures simulation; EM wave scattering; MoM; circuit analog boundary condition; circuit analog sheets; computational electromagnetics; explicit expressions; inhomogeneous multilayered screens; matrix boundary condition; nonmetallic bulk structures; single/multilayer sheets; surface integral equations; three dimensional surfaces; transmission line model; Aircraft propulsion; Application software; Boundary conditions; Computational modeling; Computer science; Conductivity; Distributed parameter circuits; Integral equations; Laboratories; Reflection;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 1999. IEEE

Conference_Location

Orlando, FL, USA

Print_ISBN

0-7803-5639-x

Type

conf

DOI

10.1109/APS.1999.788312

Filename

788312