Title :
SPICE simulation of variant class H hybrid power module
Author :
Higashiyama, Katsuhiko
Author_Institution :
Dept. of Eng., Matsushita Electr. Ind. Corp., Osaka, Japan
Abstract :
A hybrid power module which is constructed using eight silicon chips and uses high efficiency variant class H amplifiers is described. The thermal modeling of the hybrid die-package structures and a macromodeling of the variant class H amplifiers using SPICE is discussed. Experimental and simulation results are compared for the hybrid power module
Keywords :
SPICE; audio-frequency amplifiers; circuit analysis computing; integrated circuit packaging; power amplifiers; SPICE simulation; audio power amplifiers; die-package structures; hybrid power module; macromodeling; thermal modeling; variant class H amplifiers; Circuit simulation; Dynamic range; Multichip modules; Operational amplifiers; Power amplifiers; Power supplies; SPICE; Silicon; Switching circuits; Voltage control;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1995, Proceedings of 1995 Japan International, 18th IEEE/CPMT International
Conference_Location :
Omiya
Print_ISBN :
0-7803-3622-4
DOI :
10.1109/IEMT.1995.541090
