• DocumentCode
    343594
  • Title

    Microstrip antennas for dielectric property measurement

  • Author

    Deffendol, C. ; Furse, C.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Utah State Univ., Logan, UT, USA
  • Volume
    3
  • fYear
    1999
  • fDate
    11-16 July 1999
  • Firstpage
    1954
  • Abstract
    The measurement of the dielectric properties of materials is of great interest in a variety of applications including measurement of the moisture, fat, salt, or sugar content of grains and food products, measurement of human tissues or artificial phantom materials used to simulate them, and many other scientific and commercial applications. Conventional methods of measuring these properties include coaxial measuring probes or cylindrical capacitive cells. The commercial equipment available for this purpose is generally too expensive to be used "in-line" and may be too fragile for many applications in harsh conditions. This paper describes microstrip antenna designs for the determination of dielectric properties. These antennas are designed for durability in extreme conditions and utilize a change of impedance when in direct or near contact to the sample to determine the dielectric properties.
  • Keywords
    dielectric materials; dielectric properties; electric impedance; microstrip antennas; slot antennas; artificial phantom materials; coaxial measuring probes; commercial applications; commercial equipment; cylindrical capacitive cells; dielectric property measurement; durability; extreme conditions; fat; food products; grains; human tissues; impedance change; microstrip antenna designs; moisture; rectangular patch; salt; scientific applications; slotted patch antenna; sugar content; Antenna measurements; Anthropometry; Biological materials; Dielectric materials; Dielectric measurements; Food products; Humans; Imaging phantoms; Microstrip antennas; Moisture measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 1999. IEEE
  • Conference_Location
    Orlando, FL, USA
  • Print_ISBN
    0-7803-5639-x
  • Type

    conf

  • DOI
    10.1109/APS.1999.788341
  • Filename
    788341