DocumentCode
3436278
Title
Definition of an innovative filling structure for digital blocks : the DFM filler cell
Author
Remy, Laurent ; Coll, Philippe ; Picot, Fabrice ; Mico, Philippe ; Portal, Jean-Michel
Author_Institution
ATMEL Rousset, Rousset, France
fYear
2009
fDate
13-16 Dec. 2009
Firstpage
73
Lastpage
76
Abstract
A DFM approach considers all interactions in the production flow and breaks the standard local/global context. Understanding existing solutions and their limitations in filling solution for digital blocks, we present in this paper a DFM filler cell solution that takes into account a large amount of problems that can be encountered at many steps of the production flow, such as lithography or planarity variations, while other kinds of filler cells only solve density problems. This allows designs to be less dependent on the global context of the digital block. Our DFM filler cell reduces the STI width stress impact, contains dummy polysilicon gates that allow an OPC-friendly approach and is more flexible for the place and route step. Our approach was validated by a silicon structure and many published data in this domain. The insertion of DFM filler cells is costless in terms of area thanks of their size that are multiple of the grid size. Furthermore, the usage of DFM filler cell in the complete design flow was validated.
Keywords
design for manufacture; filling; proximity effect (lithography); silicon; DFM filler cell; OPC-friendly approach; Si; design for manufacture; digital blocks; dummy polysilicon gates; global context; innovative filling structure; lithography; planarity variations; production flow; Chemical technology; Design for manufacture; Design methodology; Filling; Flow production systems; Lithography; Manufacturing processes; Portals; Silicon; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics, Circuits, and Systems, 2009. ICECS 2009. 16th IEEE International Conference on
Conference_Location
Yasmine Hammamet
Print_ISBN
978-1-4244-5090-9
Electronic_ISBN
978-1-4244-5091-6
Type
conf
DOI
10.1109/ICECS.2009.5410922
Filename
5410922
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