• DocumentCode
    3436590
  • Title

    Friction and pull-off force on silicon surface modified by FIB

  • Author

    Ando, Yasuhisa ; Ino, J. ; Ozaki, Koichi ; Ishikawa, Yuichi ; Kitahara, Tokio

  • Author_Institution
    Lab. Mech. Eng., Chuo Univ., Tokyo, Japan
  • fYear
    1996
  • fDate
    11-15 Feb 1996
  • Firstpage
    349
  • Lastpage
    353
  • Abstract
    The friction and adhesion forces were measured for silicon surfaces that had various patterns having cyclic asperity. The patterns were created by using a focused ion beam (FIB) to mill ditches and to deposit platinum mounds. To study the effect of cyclic asperity on the forces, the friction and pull-off forces were measured between the pattern and a flat, square scanning probe (0.7×0.7 μm2 ) of an atomic force microscope (AFM). Both the friction and pull-off forces decreased as the asperity increased (i.e., as the ditch depth or mound height increased). The decrease was greater for the cyclic ditches than for the cyclic mounds. The friction force was proportional to the pull-off force, which indicates the importance of reducing the adhesion force when devising lubrication methods for micromachines and micro-electro mechanical systems (MEMS)
  • Keywords
    atomic force microscopy; elemental semiconductors; focused ion beam technology; friction; ion beam applications; mechanical variables measurement; micromechanical devices; microscopy; silicon; sputter etching; surface phenomena; surface structure; FIB; MEMS; Pt mounds; Si; Si surface; adhesion forces; atomic force microscope; cyclic asperity; cyclic ditches; focused ion beam; friction; lubrication; micro-electro mechanical systems; pull-off force; pull-off forces; silicon surfaces; square scanning probe; Adhesives; Atomic force microscopy; Atomic measurements; Force measurement; Friction; Ion beams; Milling machines; Platinum; Probes; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1996, MEMS '96, Proceedings. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems. IEEE, The Ninth Annual International Workshop on
  • Conference_Location
    San Diego, CA
  • Print_ISBN
    0-7803-2985-6
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1996.494006
  • Filename
    494006