DocumentCode :
3436615
Title :
Thermal-Aware Test Data Compression Using Dictionary Based Coding
Author :
Karmakar, R. ; Chattopadhyay, S.
Author_Institution :
Dept. of Electron. & Electr. Commun. Eng., Indian Inst. of Technol. Kharagpur, Kharagpur, India
fYear :
2015
fDate :
3-7 Jan. 2015
Firstpage :
53
Lastpage :
58
Abstract :
In this paper, we have proposed a new thermal-aware test data compression technique using dictionary based coding. Huge test data volume and chip temperature are two major challenges for test engineers. Temperature of a chip can be reduced to a large extent by minimizing transition count in scan chains using efficient don´t-care filling. On the other hand, high compression ratio can be achieved by filling the don´t-cares intelligently to get more similar sub-vectors from test vectors. Although, both of the problems rely on don´t-care bit filling, most of the existing works have considered them as separate problems. In our work, we have combined both temperature reduction and compression into a single problem and solved it. We present an intermediate approach that performs a trade-off between temperature and compression ratio. Experimental results on ISCAS´89 and ITC´99 benchmarks show the flexibility of the proposed method to achieve a balance between temperature and compression ratio.
Keywords :
electronic engineering computing; integrated circuit testing; vectors; chip temperature; dictionary based coding; temperature reduction; test data volume; test vector; thermal-aware test data compression; transition count; Benchmark testing; Circuit faults; Dictionaries; Power demand; Temperature distribution; Test data compression; Compression; dictionary based coding; don´t-care bits; temperature reduction;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Design (VLSID), 2015 28th International Conference on
Conference_Location :
Bangalore
ISSN :
1063-9667
Type :
conf
DOI :
10.1109/VLSID.2015.14
Filename :
7031707
Link To Document :
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