Micro tensile-test system fabricated on a single crystal silicon chip

Author

Sato, Kazuo ; Shikida, Mitsuhiro ; Yamasaki, Masanori ; Yoshioka, Tetsuo

Author_Institution

Dept. of Micro Syst. Eng., Nagoya Univ., Japan

fYear

1996

fDate

11-15 Feb 1996

Firstpage

360

Lastpage

364

Abstract

We have developed a uniaxial tensile test structure on a single crystal silicon chip. This enables tensile testing of MEMS materials, such as bulk silicon and thin film materials, to be carried out directly on the chip without manipulating a small specimen during the test procedure as in previous work. The structure was designed so that uniaxial force is applied to the specimen when a lever structure on the same chip is loaded perpendicular to the surface. The chip was fabricated on a (100) silicon wafer using chemical anisotropic etching

Keywords

etching; materials testing; micromachining; micromechanical devices; tensile testing; test equipment; torsion; (100) wafer; MEMS materials testing; Si; anisotropic etching; bulk materials testing; knife edge support; lever structure; micro tensile-test system; on chip testing; single crystal chip; thin film materials testing; torsion bars deflection; uniaxial tensile test structure; Biomembranes; Chemicals; Crystalline materials; Etching; Materials testing; Mechanical factors; Semiconductor thin films; Silicon; Tensile stress; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 1996, MEMS '96, Proceedings. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems. IEEE, The Ninth Annual International Workshop on

Conference_Location

San Diego, CA

Print_ISBN

0-7803-2985-6

Type

conf

DOI

10.1109/MEMSYS.1996.494008

Filename

494008