Title :
Inorganic bonded mica paper for commutator and high-temperature applications
Author :
Doyle, Arthur F. ; Sklarski, Dennis J.
Author_Institution :
Essex Group Inc., Newmarket, NH, USA
Abstract :
An inorganic bonded mica paper plate has been developed. It offers superior performance as commutator segment insulation. The recent history of commutator insulation in traction motors and the development of inorganic bonded mica paper (reconstituted mica) plate to meet the stringent requirements of tungsten-inert gas (TIG) welding and thermal stability under high pressure are reported. Other potential uses for this electrical insulating material in different applications, and as an alternative for asbestos-based products, are discussed
Keywords :
machine insulation; TIG welding; commutator; development; electric machine insulation; electrical insulating material; high-temperature applications; history; inorganic bonded mica paper; performance; thermal stability; Bonding; Chemicals; Commutation; Composite materials; Dielectrics and electrical insulation; Insulation life; Resins; Temperature; Thermal stability; Traction motors;
Conference_Titel :
Electrical Electronics Insulation Conference and Electrical Manufacturing & Coil Winding Conference, 1993. Proceedings., Chicago '93 EEIC/ICWA Exposition
Conference_Location :
Chicago, IL
Print_ISBN :
0-7803-0847-6
DOI :
10.1109/EEIC.1993.631086
