• DocumentCode
    3436765
  • Title

    Simulation of electron tunneling in HEMT devices

  • Author

    Lyumkis, E. ; Mickevicius, R. ; Penzin, O. ; Polsky, B. ; El Sayed, K.

  • Author_Institution
    Integrated Syst. Eng. Inc., San Jose, CA, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    179
  • Lastpage
    184
  • Abstract
    We report results of 2D simulations of the electron tunneling through hetero-interfaces and gate Schottky contact in AlGaAs/InGaAs HEMT. For the first time the rigorous non-local tunneling models have been applied for heterostructure device simulations. The simulations have been performed within hydrodynamic transport model to account for hot electrons. The tunneling through hetero-interfaces fully controls the drain current. The tunneling through the Schottky barrier is responsible for the gate leakage and can significantly affect the transfer characteristics. Further, we have found that the breakdown characteristics of a HEMT are strongly affected by the gate leakage due to tunneling through the Schottky barrier. This effect may lead to a considerable underestimation of the HEMT breakdown voltage, when non-destructive measurement methods are applied
  • Keywords
    III-V semiconductors; Schottky barriers; aluminium compounds; gallium arsenide; high electron mobility transistors; hot carriers; indium compounds; semiconductor device models; tunnel transistors; AlGaAs; AlGaAs/InGaAs HEMT; HEMT devices; InGaAs; drain current; electron tunneling; gate Schottky contact; gate leakage; hetero-interfaces; heterostructure device simulations; hot electrons; hydrodynamic transport model; nonlocal tunneling models; transfer characteristics; Electric breakdown; Electrons; Electrostatics; Gate leakage; HEMTs; Hydrodynamics; Modeling; Schottky barriers; Systems engineering and theory; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Compound Semiconductors, 2000 IEEE International Symposium on
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    0-7803-6258-6
  • Type

    conf

  • DOI
    10.1109/ISCS.2000.947150
  • Filename
    947150