DocumentCode :
3436998
Title :
Quick recovery in Transactional Flash
Author :
Kulkarni, Nandkumar ; Gopinath, Krishnasamy
Author_Institution :
Comput. Sci. & Autom, Indian Inst. of Sci., Bangalore, India
fYear :
2013
fDate :
17-19 Jan. 2013
Firstpage :
1
Lastpage :
6
Abstract :
Maintaining metadata consistency is a critical issue in designing a filesystem. Although satisfactory solutions are available for filesystems residing on magnetic disks, these solutions may not give adequate performance for filesystems residing on flash devices. Prabhakaran et al. have designed a metadata consistency mechanism specifically for flash chips, called Transactional Flash[1]. It uses cyclic commit mechanism to provide transactional abstractions. Although significant improvement over usual journaling techniques, this mechanism has certain drawbacks such as complex protocol and necessity to read whole flash during recovery, which slows down recovery process. In this paper we propose addition of thin journaling layer on top of Transactional Flash to simplify the protocol and speed up the recovery process. The simplified protocol named Quick Recovery Cyclic Commit (QRCC) uses journal stored on NOR flash for recovery. Our evaluations on actual raw flash card show that journal writes add negligible penalty compared to original Transactional Flash´s write performance, while quick recovery is facilitated by journal in case of failures.
Keywords :
file organisation; magnetic disc storage; meta data; NOR flash; QRCC; complex protocol; cyclic commit mechanism; filesystem design; flash chips; flash devices; journaling techniques; magnetic disks; metadata consistency mechanism; quick recovery cyclic commit; quick recovery process; raw flash card; transactional abstractions; transactional flash; transactional flash write performance; Ash; Benchmark testing; Kernel; Nonvolatile memory; Protocols; Random access memory; Strips;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics, Computing and Communication Technologies (CONECCT), 2013 IEEE International Conference on
Conference_Location :
Bangalore
Print_ISBN :
978-1-4673-4609-2
Type :
conf
DOI :
10.1109/CONECCT.2013.6469317
Filename :
6469317
Link To Document :
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