An improved valve-less pump fabricated using deep reactive ion etching

Author

Olsson, Anders ; Enoksson, Peter ; Stemme, Göran ; Stemme, Erik

Author_Institution

Dept. of Signals, Sensors & Syst., R. Inst. of Technol., Stockholm, Sweden

fYear

1996

fDate

11-15 Feb 1996

Firstpage

479

Lastpage

484

Abstract

We present the first valve-less diffuser pump fabricated using the latest technology in deep reactive ion etching (DRIE). The pump is fabricated in a simple micromachining process in a double side polished silicon wafer anodically bonded to a glass wafer. Pump chambers and diffuser elements are etched in the silicon wafer using DRIE while inlet and outlet holes are etched using an anisotropic KOH-etch. The DRIE etch resulted in rectangular diffuser cross-sections. We present results on pumps with different diffuser dimensions in terms of diffuser neck width, length and angle. We reached a maximum pump pressure of 7.6 m H ₂O (74 kPa) and maximum pump flow of 2.3 ml/min for water

Keywords

fluidic devices; micromachining; micropumps; sputter etching; 74 kPa; Si; anisotropic KOH-etch; anodic bonding; deep reactive ion etching; diffuser angle; diffuser elements; diffuser length; diffuser neck width; double side polished Si wafer; glass wafer; maximum pump flow; maximum pump pressure; methanol; micromachining process; pump chambers; rectangular diffuser cross-sections; valve-less diffuser pump fabrication; water; Chemical elements; Etching; Glass; Micromachining; Micropumps; Pumps; Sensor systems; Silicon; Valves; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 1996, MEMS '96, Proceedings. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems. IEEE, The Ninth Annual International Workshop on

Conference_Location

San Diego, CA

Print_ISBN

0-7803-2985-6

Type

conf

DOI

10.1109/MEMSYS.1996.494029

Filename

494029