DocumentCode
3437120
Title
Dynamic error analysis for six degrees of freedom micro-displacement mechanism in reticle stage of lithography machine
Author
Dashuang Luo ; Kesheng Wang ; Longlong Zhang ; Jing Li ; Hong-Zhong Huang ; Yu Liu
Author_Institution
Sch. of Mech., Electron., & Ind. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear
2013
fDate
15-18 July 2013
Firstpage
529
Lastpage
535
Abstract
Multi-layer lithography machine is one of the crucial equipments in the semiconductor integrated circuit industry. Recently, more and more research interests have been attracted to develop higher precision lithography machine. The error analysis plays an important role in the development of ultra-precision lithography machine. In this paper, the error analysis of six degrees of freedom micro-displacement mechanism of reticle stage in multi-layer lithography is studied. Based upon the geometric model of micro-displacement mechanism, an error analysis model is established through kinematic method and homogeneous coordinate array. Orthogonal test is adopted to reveal the quantitative relationship between the motor errors and the output errors in resultant movement. A brief discussion on the influence of motor errors in different directions is proposed. This error model provides a theoretical basis for design and optimization of lithography machine.
Keywords
error analysis; lithography; monolithic integrated circuits; degrees of freedom; dynamic error analysis; error analysis model; geometric model; kinematic method; lithography machine; micro-displacement mechanism; motor errors; orthogonal test; output errors; semiconductor integrated circuit industry; Analytical models; Arrays; Error analysis; Kinematics; Lithography; Mathematical model; Vectors; error analysis; error model; lithography machine; micro-displacement mechanism; orthogonal test; six degrees of freedom;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE), 2013 International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4799-1014-4
Type
conf
DOI
10.1109/QR2MSE.2013.6625639
Filename
6625639
Link To Document