• DocumentCode
    3437120
  • Title

    Dynamic error analysis for six degrees of freedom micro-displacement mechanism in reticle stage of lithography machine

  • Author

    Dashuang Luo ; Kesheng Wang ; Longlong Zhang ; Jing Li ; Hong-Zhong Huang ; Yu Liu

  • Author_Institution
    Sch. of Mech., Electron., & Ind. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2013
  • fDate
    15-18 July 2013
  • Firstpage
    529
  • Lastpage
    535
  • Abstract
    Multi-layer lithography machine is one of the crucial equipments in the semiconductor integrated circuit industry. Recently, more and more research interests have been attracted to develop higher precision lithography machine. The error analysis plays an important role in the development of ultra-precision lithography machine. In this paper, the error analysis of six degrees of freedom micro-displacement mechanism of reticle stage in multi-layer lithography is studied. Based upon the geometric model of micro-displacement mechanism, an error analysis model is established through kinematic method and homogeneous coordinate array. Orthogonal test is adopted to reveal the quantitative relationship between the motor errors and the output errors in resultant movement. A brief discussion on the influence of motor errors in different directions is proposed. This error model provides a theoretical basis for design and optimization of lithography machine.
  • Keywords
    error analysis; lithography; monolithic integrated circuits; degrees of freedom; dynamic error analysis; error analysis model; geometric model; kinematic method; lithography machine; micro-displacement mechanism; motor errors; orthogonal test; output errors; semiconductor integrated circuit industry; Analytical models; Arrays; Error analysis; Kinematics; Lithography; Mathematical model; Vectors; error analysis; error model; lithography machine; micro-displacement mechanism; orthogonal test; six degrees of freedom;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE), 2013 International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4799-1014-4
  • Type

    conf

  • DOI
    10.1109/QR2MSE.2013.6625639
  • Filename
    6625639