Title :
Mitigation of signal vias to power plane coupling controlling the return current
Author :
Scogna, A.C. ; Jianmin Zhang ; LianKheng Teoh
Author_Institution :
CST of America, Framingham, MA, USA
Abstract :
This paper presents a solution to mitigate the signal vias to power plane coupling using controlled-return-current guard traces with shorting vias. The proposed design allow to considerably suppress the noise due to uncontrolled return path of the current coupled to power planes in multilayered packages and boards, avoiding signal integrity and electromagnetic interference problems.
Keywords :
electric current control; electromagnetic interference; electronics packaging; interference suppression; printed circuits; vias; controlled-return-current guard traces; electromagnetic interference problems; multilayered packages; noise suppression; power plane coupling; return current control; shorting vias; signal integrity; signal vias mitigation; uncontrolled return path; Couplings; Electromagnetic interference; Microstrip; Noise; Packaging; Probes; Silicon;
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1444-2
Electronic_ISBN :
978-1-4673-1445-9
DOI :
10.1109/EDAPS.2012.6469386
