DocumentCode
3437205
Title
Mitigation of signal vias to power plane coupling controlling the return current
Author
Scogna, A.C. ; Jianmin Zhang ; LianKheng Teoh
Author_Institution
CST of America, Framingham, MA, USA
fYear
2012
fDate
9-11 Dec. 2012
Firstpage
69
Lastpage
72
Abstract
This paper presents a solution to mitigate the signal vias to power plane coupling using controlled-return-current guard traces with shorting vias. The proposed design allow to considerably suppress the noise due to uncontrolled return path of the current coupled to power planes in multilayered packages and boards, avoiding signal integrity and electromagnetic interference problems.
Keywords
electric current control; electromagnetic interference; electronics packaging; interference suppression; printed circuits; vias; controlled-return-current guard traces; electromagnetic interference problems; multilayered packages; noise suppression; power plane coupling; return current control; shorting vias; signal integrity; signal vias mitigation; uncontrolled return path; Couplings; Electromagnetic interference; Microstrip; Noise; Packaging; Probes; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE
Conference_Location
Taipei
Print_ISBN
978-1-4673-1444-2
Electronic_ISBN
978-1-4673-1445-9
Type
conf
DOI
10.1109/EDAPS.2012.6469386
Filename
6469386
Link To Document