• DocumentCode
    343733
  • Title

    In-board magnetics processes

  • Author

    Zhang, Yi E. ; Sanders, Seth R.

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
  • Volume
    1
  • fYear
    1999
  • fDate
    36373
  • Firstpage
    561
  • Abstract
    This paper introduces a design and manufacturing process for integrating magnetic components, transformers and inductors, within a multilayer printed circuit board (PCB). As such, the magnetic core constitutes one or more of the layers of the PCB. This structure has a number of potentially advantageous features. The thickness of the resulting magnetic component can be rather small, comparable to that of standard laminated multilayer PCBs. If the traces used to form the turns of the magnetic devices are internal layers of the multilayer PCB, the surface real estate occupied by the magnetic device is fully available for other surface mountable components. Thus, this technology offers great advantage in packaging density. In addition, the planar type form factor provides for a large surface area to volume ratio, allowing for effective heat transfer from the magnetic device
  • Keywords
    inductors; laminations; magnetic cores; printed circuits; transformers; PCB; design process; inductors; integrated magnetic components; manufacturing process; multilayer printed circuit board; on-board magnetics processes; packaging density; planar type form factor; surface area to volume ratio; transformers; Heat transfer; Inductors; Magnetic cores; Magnetic devices; Magnetic multilayers; Manufacturing processes; Packaging; Printed circuits; Process design; Transformers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics Specialists Conference, 1999. PESC 99. 30th Annual IEEE
  • Conference_Location
    Charleston, SC
  • ISSN
    0275-9306
  • Print_ISBN
    0-7803-5421-4
  • Type

    conf

  • DOI
    10.1109/PESC.1999.789072
  • Filename
    789072