DocumentCode
343733
Title
In-board magnetics processes
Author
Zhang, Yi E. ; Sanders, Seth R.
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Volume
1
fYear
1999
fDate
36373
Firstpage
561
Abstract
This paper introduces a design and manufacturing process for integrating magnetic components, transformers and inductors, within a multilayer printed circuit board (PCB). As such, the magnetic core constitutes one or more of the layers of the PCB. This structure has a number of potentially advantageous features. The thickness of the resulting magnetic component can be rather small, comparable to that of standard laminated multilayer PCBs. If the traces used to form the turns of the magnetic devices are internal layers of the multilayer PCB, the surface real estate occupied by the magnetic device is fully available for other surface mountable components. Thus, this technology offers great advantage in packaging density. In addition, the planar type form factor provides for a large surface area to volume ratio, allowing for effective heat transfer from the magnetic device
Keywords
inductors; laminations; magnetic cores; printed circuits; transformers; PCB; design process; inductors; integrated magnetic components; manufacturing process; multilayer printed circuit board; on-board magnetics processes; packaging density; planar type form factor; surface area to volume ratio; transformers; Heat transfer; Inductors; Magnetic cores; Magnetic devices; Magnetic multilayers; Manufacturing processes; Packaging; Printed circuits; Process design; Transformers;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics Specialists Conference, 1999. PESC 99. 30th Annual IEEE
Conference_Location
Charleston, SC
ISSN
0275-9306
Print_ISBN
0-7803-5421-4
Type
conf
DOI
10.1109/PESC.1999.789072
Filename
789072
Link To Document