• DocumentCode
    3437357
  • Title

    The improvement of signal quality and far-end crosstalk for coupled microstrip line over a completely split ground plane

  • Author

    Ding-Bing Lin ; Ruei-Hua Shen

  • Author_Institution
    Grad. Inst. of Comput. & Commun. Eng., Nat. Taipei Univ. of Technol., Taipei, Taiwan
  • fYear
    2012
  • fDate
    9-11 Dec. 2012
  • Firstpage
    139
  • Lastpage
    141
  • Abstract
    In the modern generation of digitally high-speed data transmission, multiple power level demands may be required. In the view of signal integrity, the worst case is to cut completely a slit on the ground plane during traces traversing over because the scenario like that will lead to serious signal quality and crosstalk problems. So here we proposed one new solution to improve signal quality and far-end crosstalk (FEXT) by using interdigital capacitor. The basic working principle of this structure is by the property of the displacement capacitor and it needs no extra components. The experimental results indicated that our solution could improve signal quality and reduce FEXT by 29.87% and 8.87% in the time domain, respectively. And the result of eye diagram under 6 Gbps bit rate also showed the improvement of eye height 59% and eye width 7%. The statement above showed that our design requires no extra components to improve signal quality and reduce FEXT.
  • Keywords
    capacitors; crosstalk; microstrip lines; printed circuit layout; FEXT; bit rate 6 Gbit/s; completely split ground plane; coupled microstrip line; displacement capacitor; eye diagram; eye height; far-end crosstalk; high speed data transmission; interdigital capacitor; signal quality; Capacitors; Crosstalk; Metals; Noise; Packaging; Time domain analysis; Time measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4673-1444-2
  • Electronic_ISBN
    978-1-4673-1445-9
  • Type

    conf

  • DOI
    10.1109/EDAPS.2012.6469392
  • Filename
    6469392