DocumentCode
3437357
Title
The improvement of signal quality and far-end crosstalk for coupled microstrip line over a completely split ground plane
Author
Ding-Bing Lin ; Ruei-Hua Shen
Author_Institution
Grad. Inst. of Comput. & Commun. Eng., Nat. Taipei Univ. of Technol., Taipei, Taiwan
fYear
2012
fDate
9-11 Dec. 2012
Firstpage
139
Lastpage
141
Abstract
In the modern generation of digitally high-speed data transmission, multiple power level demands may be required. In the view of signal integrity, the worst case is to cut completely a slit on the ground plane during traces traversing over because the scenario like that will lead to serious signal quality and crosstalk problems. So here we proposed one new solution to improve signal quality and far-end crosstalk (FEXT) by using interdigital capacitor. The basic working principle of this structure is by the property of the displacement capacitor and it needs no extra components. The experimental results indicated that our solution could improve signal quality and reduce FEXT by 29.87% and 8.87% in the time domain, respectively. And the result of eye diagram under 6 Gbps bit rate also showed the improvement of eye height 59% and eye width 7%. The statement above showed that our design requires no extra components to improve signal quality and reduce FEXT.
Keywords
capacitors; crosstalk; microstrip lines; printed circuit layout; FEXT; bit rate 6 Gbit/s; completely split ground plane; coupled microstrip line; displacement capacitor; eye diagram; eye height; far-end crosstalk; high speed data transmission; interdigital capacitor; signal quality; Capacitors; Crosstalk; Metals; Noise; Packaging; Time domain analysis; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE
Conference_Location
Taipei
Print_ISBN
978-1-4673-1444-2
Electronic_ISBN
978-1-4673-1445-9
Type
conf
DOI
10.1109/EDAPS.2012.6469392
Filename
6469392
Link To Document