DocumentCode :
3437466
Title :
Recessed MOSFET in 28 nm FDSOI for Better Breakdown Characteristics
Author :
Kranthi, N.K. ; Sithanandam, R. ; Komaragiri, R.
Author_Institution :
STMicroelectron., Noida, India
fYear :
2015
fDate :
3-7 Jan. 2015
Firstpage :
282
Lastpage :
285
Abstract :
In this work, a novel recessed structure is proposed which improves the electric field distributions at the drain channel junction, hence the breakdown voltage. Technology computer aided design simulation results showed that the off state breakdown voltage of a 28 nm Fully Depleted Silicon on Insulator MOSFET is extended from 1.8V to 3.3 V or more. A detailed study is presented on the breakdown and DC characteristics of the same device. An asymmetric version of the same is also studied to further enhance the breakdown voltage and DC characteristics with and without Ground Plane (GP).
Keywords :
MOSFET; semiconductor device breakdown; silicon-on-insulator; DC characteristics; FDSOI; breakdown characteristics; breakdown voltage; drain-channel junction; electric field distributions; fully depleted silicon on insulator; ground plane; recessed MOSFET; size 28 nm; Electric breakdown; Electric fields; Junctions; Logic gates; MOSFET; Resistance; Transconductance; Breakdown voltage; FDSOI; Ground Plane; Recessed;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Design (VLSID), 2015 28th International Conference on
Conference_Location :
Bangalore
ISSN :
1063-9667
Type :
conf
DOI :
10.1109/VLSID.2015.54
Filename :
7031747
Link To Document :
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