• DocumentCode
    343759
  • Title

    Analysis of lossy microstrips using two-dimensional equations for planar circuits

  • Author

    Tugulea, A. ; Ciric, I.R.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Manitoba Univ., Winnipeg, Man., Canada
  • Volume
    1
  • fYear
    1999
  • fDate
    11-16 July 1999
  • Firstpage
    226
  • Abstract
    The analysis of attenuation and dispersion along transmission lines is important particularly at high frequencies. In the case of microstrip lines the wave attenuation is caused by the conductor loss, the substrate loss, and the radiation loss. The conductor loss is due to the finite conductivity of the strip material and is related to the skin depth of the conductor. Also, the current density near the edges of the microstrip is much higher and this contributes to the wave attenuation. We present a model for lossy microstrip lines based on the quasistationary field theory of the microwave planar structures. The model presented allows the evaluation of both the attenuation and the dispersion of lossy microstrips. A good agreement with experimental data is obtained even at higher frequencies.
  • Keywords
    absorbing media; dispersion (wave); electromagnetic wave absorption; losses; microstrip lines; microwave circuits; partial differential equations; waveguide theory; conductor loss; current density; experimental data; high frequencies; lossy microstrip lines; microwave planar structures; partial differential equations; planar circuits; quasistationary field theory; radiation loss; skin depth; strip material conductivity; substrate loss; transmission lines; two-dimensional equations; wave attenuation; wave dispersion; Attenuation; Conducting materials; Conductivity; Current density; Equations; Frequency; Microstrip; Skin; Strips; Transmission line theory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 1999. IEEE
  • Conference_Location
    Orlando, FL, USA
  • Print_ISBN
    0-7803-5639-x
  • Type

    conf

  • DOI
    10.1109/APS.1999.789122
  • Filename
    789122