DocumentCode
3437602
Title
Collapse of MOSFET drain current after soft breakdown and its dependence on the transistor aspect ratio W/L
Author
Cester, A. ; Cimino, S. ; Paccagnella, A. ; Ghidini, G. ; Guegan, G.
Author_Institution
Dipt. di Ingegneria dell´´Informazione, Padova Univ., Italy
fYear
2003
fDate
30 March-4 April 2003
Firstpage
189
Lastpage
195
Abstract
Gate oxide soft breakdown (SB) can have a severe impact on MOSFET performance even when not producing any large increase of the gate leakage current. The soft breakdown effect on the MOSFET characteristics strongly depends on the aspect ratio W/L: drain saturation current and MOSFET transconductance dramatically drop in transistors with small W/L after soft breakdown. As W/L increases, the SB effect on the drain current fades. The drain saturation current and transconductance collapse are due to the formation of an oxide defective region around the SB spot, the area of which is much larger than the SB conductive path. Similar degradation can be observed even in heavy ion irradiated MOSFETs where localized damaged oxide regions are generated by the impinging ions without producing, any increase of gate leakage current.
Keywords
MOSFET; ion beam effects; leakage currents; semiconductor device breakdown; semiconductor device reliability; semiconductor device testing; MOSFET; degradation; drain current collapse; drain saturation current; gate leakage current; gate oxide soft breakdown; heavy ion irradiated MOSFETs; localized damaged oxide regions; oxide defective region; oxide reliability; transconductance collapse; transistor aspect ratio; Circuit noise; Degradation; Electric breakdown; Electric variables; Energy consumption; Leakage current; MOSFET circuits; Microelectronics; Transconductance; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International
Print_ISBN
0-7803-7649-8
Type
conf
DOI
10.1109/RELPHY.2003.1197744
Filename
1197744
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