Title :
The past, present and future of EEE components for space application; COTS-the next generation
Author :
Wall, John ; Sinnadura, Nihal
Author_Institution :
Defence Evaluation & Res. Agency, UK
Abstract :
Electrical, Electronic and Electromechanical (EEE) components may represent only 5% of a total space system cost, but at an individual equipment level they can be 50%. This can seriously disadvantage equipment suppliers. Commercial pressures, largely due to the massive increases in demand from other sectors, are reducing the number of manufacturers interested in supplying the specialised space market. Both of these factors represent a challenge for the space industry. This paper identifies component industry trends, examines the traditional methods of achieving “space quality”, addresses how the space industry can adapt to this changing scenario, looks at the options for space standardisation/qualification, challenges some established practices and, finally, considers performance specifications
Keywords :
concurrent engineering; electron device manufacture; electronic equipment manufacture; fault trees; integrated circuit packaging; integrated circuit reliability; military avionics; military standards; product development; radiation hardening (electronics); semiconductor device packaging; semiconductor device reliability; space vehicle electronics; standardisation; statistical process control; EEE components; IC markets; commercial off the shelf; commercial pressures; component industry trends; concurrent engineering; electrical/electronic/electromechanical components; equipment suppliers; fault tree; good practice; military standards; next generation; package mounting trends; performance specifications; procurement; radiation environment; relative sales; reliability requirements; single event effects; space application; space qualification; space quality; space standardisation; specialised space market; statistical process control; upscreening; Aerospace industry; Consumer electronics; Costs; Electronics packaging; Europe; Manufacturing industries; Marketing and sales; Plastics; Production; Semiconductor device manufacture;
Conference_Titel :
Frequency Control Symposium, 1998. Proceedings of the 1998 IEEE International
Conference_Location :
Pasadena, CA
Print_ISBN :
0-7803-4373-5
DOI :
10.1109/FREQ.1998.717933