DocumentCode
3437721
Title
Influence of via stubs with different terminations on time-domain transmission waveform and eye diagram in multilayer PCBs
Author
Chi-Lou Yeh ; Yi-Chin Tsai ; Che-Ming Hsu ; Li-Sang Liu ; Sheng-Hsun Tsai ; Yu Han Kao ; Guang-Hwa Shiue
Author_Institution
Master Program in Commun. Eng., Chung Yuan Christian Univ., Taoyuan, Taiwan
fYear
2012
fDate
9-11 Dec. 2012
Firstpage
149
Lastpage
152
Abstract
Plated though-hole (PTH) vias are extensively adopted in multilayer printed circuit boards (PCBs). Unused portions of PTH vias become open stubs, which excite the resonance mode and degrade signal integrity (SI). This work investigates how open via stubs in multilayer PCBs affect the time-domain transmission (TDT) waveform and eye diagram. Exactly how time-domain reflection affects the open via stubs on TDT waveform is also studied using the lattice diagram. Additionally, the R and RL terminations of open via stubs are developed to improve SI in previous studies. Moreover, the RC termination of open via stubs is proposed to improve the performance of SI, which is the same as that of the R termination in this work. RC termination is also characterized by its nearly zero DC power consumption. Furthermore, different terminations are compared with respect to how they improve the TDT waveforms and eye diagrams.
Keywords
printed circuits; signal processing; DC power consumption; TDT waveform; eye diagram; lattice diagram; multilayer PCB; multilayer printed circuit boards; open stubs; plated though hole vias; signal integrity; time domain reflection; time domain transmission waveform; via stubs; Integrated circuits; Silicon; Time domain analysis; lattice diagram; open stubs; plated though-hole (PTH) vias; signal integrity; termination; time-domain transmission (TDT);
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE
Conference_Location
Taipei
Print_ISBN
978-1-4673-1444-2
Electronic_ISBN
978-1-4673-1445-9
Type
conf
DOI
10.1109/EDAPS.2012.6469414
Filename
6469414
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