• DocumentCode
    3437721
  • Title

    Influence of via stubs with different terminations on time-domain transmission waveform and eye diagram in multilayer PCBs

  • Author

    Chi-Lou Yeh ; Yi-Chin Tsai ; Che-Ming Hsu ; Li-Sang Liu ; Sheng-Hsun Tsai ; Yu Han Kao ; Guang-Hwa Shiue

  • Author_Institution
    Master Program in Commun. Eng., Chung Yuan Christian Univ., Taoyuan, Taiwan
  • fYear
    2012
  • fDate
    9-11 Dec. 2012
  • Firstpage
    149
  • Lastpage
    152
  • Abstract
    Plated though-hole (PTH) vias are extensively adopted in multilayer printed circuit boards (PCBs). Unused portions of PTH vias become open stubs, which excite the resonance mode and degrade signal integrity (SI). This work investigates how open via stubs in multilayer PCBs affect the time-domain transmission (TDT) waveform and eye diagram. Exactly how time-domain reflection affects the open via stubs on TDT waveform is also studied using the lattice diagram. Additionally, the R and RL terminations of open via stubs are developed to improve SI in previous studies. Moreover, the RC termination of open via stubs is proposed to improve the performance of SI, which is the same as that of the R termination in this work. RC termination is also characterized by its nearly zero DC power consumption. Furthermore, different terminations are compared with respect to how they improve the TDT waveforms and eye diagrams.
  • Keywords
    printed circuits; signal processing; DC power consumption; TDT waveform; eye diagram; lattice diagram; multilayer PCB; multilayer printed circuit boards; open stubs; plated though hole vias; signal integrity; time domain reflection; time domain transmission waveform; via stubs; Integrated circuits; Silicon; Time domain analysis; lattice diagram; open stubs; plated though-hole (PTH) vias; signal integrity; termination; time-domain transmission (TDT);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4673-1444-2
  • Electronic_ISBN
    978-1-4673-1445-9
  • Type

    conf

  • DOI
    10.1109/EDAPS.2012.6469414
  • Filename
    6469414