• DocumentCode
    3437811
  • Title

    A study of plastic encapsulated microcircuits (PEMs) in JPL space hardware

  • Author

    Sandor, Mike ; Cuddihy, Ed ; Agarwal, Shri

  • Author_Institution
    Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
  • fYear
    1998
  • fDate
    27-29 May 1998
  • Firstpage
    405
  • Lastpage
    421
  • Abstract
    The qualification and use of COTS parts including parts assembled with plastic packages are currently under study and evaluation by the Jet Propulsion Laboratory. Work is underway to build a database for PEMs that will aide in determining acceptance of generic part families by vendor and package. Data is being gathered on PEMs which includes radiation tolerance, outgassing, moisture absorption/desorption, acoustic microscopy, glass transition temperature, and dye penetration. The results will then be used to make quality, reliability, and risk assessments that in turn would provide projects an avenue to use COTS parts for various missions. The end objective is to establish and define criteria that will allow users of PEMs to determine their risk when plastic parts are used in lieu of traditional ceramic parts. The data and findings will be presented
  • Keywords
    acoustic microscopy; glass transition; integrated circuit packaging; integrated circuit reliability; outgassing; plastic packaging; quality management; radiation hardening (electronics); risk management; sorption; space vehicle electronics; COTS parts; Mars Pathfinder; acoustic microscopy; dye penetration; generic part families; glass transition temperature; moisture absorption/desorption; outgassing; plastic encapsulated microcircuits; plastic packages; qualification; quality assessment; radiation tolerance; reliability; risk assessment; space hardware; vendor acceptance; weight gain; Absorption; Assembly; Databases; Group technology; Laboratories; Microscopy; Moisture; Plastic packaging; Propulsion; Qualifications;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Frequency Control Symposium, 1998. Proceedings of the 1998 IEEE International
  • Conference_Location
    Pasadena, CA
  • ISSN
    1075-6787
  • Print_ISBN
    0-7803-4373-5
  • Type

    conf

  • DOI
    10.1109/FREQ.1998.717934
  • Filename
    717934