• DocumentCode
    3437880
  • Title

    Design and characterization of magnetically coupled on-chip current probe for monitoring switching current in chip I/O PDN

  • Author

    Changhyun Cho ; Kim, Jonghoon J. ; Joungho Kim ; Jun So Pak

  • Author_Institution
    Dept. of Electr. Eng., KAIST, Daejeon, South Korea
  • fYear
    2012
  • fDate
    9-11 Dec. 2012
  • Firstpage
    243
  • Lastpage
    246
  • Abstract
    In this paper, we present an on-chip embedded current probe that uses magnetic field coupling mechanism to determine on-chip switching current waveform especially in chip I/O power distribution network (PDN). We first investigate the characteristics of magnetic coupling behaviour of proposed on-chip current probing structure in various geometrical design parameters like metal width and ratio of winding turns. And then we explain our current waveform reconstruction technique which is based on time and frequency domain measurement data of our proposed on-chip current probe including magnetically induced voltage measured in time domain and transfer impedance measured in frequency domain. Numerical simulation results and experimental measurement results are shown to demonstrate the magnetic coupling behaviour of our on-chip embedded current probes which are designed using a Samsung 0.13um CMOS process.
  • Keywords
    CMOS integrated circuits; electromagnetic coupling; frequency-domain analysis; magnetic circuits; magnetic fields; numerical analysis; time-domain analysis; Samsung CMOS process; chip I/O PDN; chip I/O power distribution network; current waveform reconstruction technique; frequency-domain analysis; geometrical design parameters; magnetic coupling behaviour characteristics; magnetic field coupling mechanism; magnetically coupled on-chip current probe design; magnetically induced voltage; metal width; numerical simulation; on-chip current probing structure; on-chip switching current waveform; size 0.13 mum; time domain analysis; transfer impedance; winding turn ratio; Coils; Current measurement; Frequency measurement; Impedance; Probes; System-on-a-chip; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4673-1444-2
  • Electronic_ISBN
    978-1-4673-1445-9
  • Type

    conf

  • DOI
    10.1109/EDAPS.2012.6469422
  • Filename
    6469422