DocumentCode :
3438175
Title :
Electro-mechanical modelling of multilayer contacts in electrical connectors
Author :
Ossart, F. ; Noël, S. ; Alamarguy, D. ; Correia, S. ; Gendre, P.
Author_Institution :
Univ. Paris VI et Paris XI, Gif-sur-Yvette
fYear :
2007
fDate :
16-19 Sept. 2007
Firstpage :
1
Lastpage :
8
Abstract :
Electrical contacts are an essential part of electrical circuits and many reliability problems are related to their failure. The present work uses numerical simulation in view of a better analysis of the electromechanical phenomena, in the case of multilayer electrical contacts. We study a ball/plane contact made of bulk CuZn alloy, protected by a thin Sn surface layer. A coupled finite element analysis is performed to calculate the contact resistance of the device: an elasto-plastic model is used to determine the geometry of the contact area, then an electrical model gives the resulting constriction resistance. Results of simulation are compared to experimental data. The respective contributions of the mechanical and electrical phenomena are analysed. The influence of a nickel underlayer is also examined.
Keywords :
copper alloys; elastoplasticity; electrical contacts; finite element analysis; reliability; ball/plane contact; bulk CuZn alloy; coupled finite element analysis; elastoplastic model; electrical circuits; electrical connectors; electromechanical modelling; electromechanical phenomena; multilayer electrical contacts; numerical simulation; reliability; Circuits; Connectors; Contact resistance; Finite element methods; Nonhomogeneous media; Numerical simulation; Protection; Solid modeling; Surface resistance; Tin; constriction resistance; electric contact; finite element modelling; multilayer contact; tin coating;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical contacts - 2007, the 53rd ieee holm conference on
Conference_Location :
Pittsburgh, PA
Print_ISBN :
1-4244-0837-7
Electronic_ISBN :
1-4244-0838-5
Type :
conf
DOI :
10.1109/HOLM.2007.4318187
Filename :
4318187
Link To Document :
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