Title :
WWAN solution of NB display interface through silicon-package-board co-design
Author :
Wei-Da Guo ; Sam Yang ; Lee, Razak ; Pengchi Chen ; Lin, Tao
Author_Institution :
Himax Technol., Inc., Tainan, Taiwan
Abstract :
In addition to wireless local area network (WLAN), a wireless wide area network (WWAN) provides an alternative manner for people to connect to the internet with much larger coverage, achieved using cellular tower technology. For a typical notebook (NB) design with built-in WWAN feature, the WWAN antennas are usually located in the top or two sides of the display panel and thus susceptible to the conductive/radiative coupling of digital display signal. This paper takes advantage of the silicon-package-board (SPB) signal integrity/power integrity (SI/PI) co-simulation methodology to find out the root cause of WWAN problems as well as provide chip- and system-level solutions with real measurement validation.
Keywords :
Internet; antennas; computer displays; elemental semiconductors; notebook computers; silicon; wide area networks; wireless LAN; Internet; NB display interface; SPB SI-PI co-simulation methodology; Si; WLAN; WWAN antennas; WWAN solution; built-in WWAN feature; cellular tower technology; chip-level solution; conductive-radiative coupling; digital display signal; display panel; measurement validation; silicon-package-board co-design; silicon-package-board signal integrity-power integrity; system-level solution; typical notebook design; wireless local area network; wireless wide area network; Clocks; GSM; Inductors; Niobium; Noise; Silicon; Wireless LAN;
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1444-2
Electronic_ISBN :
978-1-4673-1445-9
DOI :
10.1109/EDAPS.2012.6469439
