Notice of RetractionFailure mode identification using thermal data based on mixed effects model in chemical mechanical planarization process

Notice of Retraction

After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.

We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.

The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.

Process variables in chemical mechanical planarization (CMP) processes such as pad temperature and coefficient of friction (COF) usually contain rich information and are highly related to process conditions and presented in a functional form, and may characterize the polishing process condition changes. In this paper, we proposed a physically motivated mixed effects model based on these process variables for process failure mode identification by separating this dynamic process into two components: heat transmission model compliant with physical laws and random effects model by latent factors. This model has been demonstrated the efficiency in distinguishing different polishing conditions through our real experimental validation.