Title :
A phenomenological theory of correlated multiple soft-breakdown events in ultra-thin gate dielectrics
Author :
Alam, Muhammad A. ; Smith, R. Kent
Author_Institution :
Agere Syst., Allentown, PA, USA
fDate :
30 March-4 April 2003
Abstract :
A general theory of the statistics of multiple breakdown events in ultra-thin gate oxides is developed. The standard theory of multiple breakdown events, based on Poisson statistics, allows only qualitative determination of the influence of each breakdown event on the rate of subsequent trap generation. In this paper, we develop a more general theory of multiple breakdown events to quantitatively determine the degree of correlation. This work allows one to calculate, regardless of the degree of correlation among the successive breakdown events, the statistical failure distribution of ICs as well as the time-dependent increase in the total leakage current during their operation. The theoretical description of leakage current not only explains a the experimental data reported in the literature to date, but also suggests a simple, yet fast experimental technique to determine the Weibull slope, the voltage- and the temperature-acceleration factors.
Keywords :
MOSFET; Poisson distribution; Weibull distribution; dielectric thin films; electric breakdown; failure analysis; integrated circuit reliability; leakage currents; percolation; semiconductor device reliability; ICs; PMOS transistors; Poisson statistics; Weibull slope; breakdown event; correlated multiple soft-breakdown events; numerical percolation model; phenomenological theory; reliability; statistical failure distribution; temperature-acceleration factors; time-dependent increase; total leakage current; trap generation; ultra-thin gate dielectrics; ultra-thin gate oxides; voltage-acceleration factors; Acceleration; Breakdown voltage; Dielectrics; Electric breakdown; Leakage current; Life estimation; Lifetime estimation; MOS devices; Silicon; Statistics;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International
Print_ISBN :
0-7803-7649-8
DOI :
10.1109/RELPHY.2003.1197782