• DocumentCode
    34383
  • Title

    Fast Wafer-Level Stress-and-Sense Methodology for Characterization of Ring-Oscillator Degradation in Advanced CMOS Technologies

  • Author

    Kerber, Andreas ; Xinggong Wan ; Yang Liu ; Nigam, Tanya

  • Author_Institution
    GLOBALFOUNDRIES, Inc., Malta, NY, USA
  • Volume
    62
  • Issue
    5
  • fYear
    2015
  • fDate
    May-15
  • Firstpage
    1427
  • Lastpage
    1432
  • Abstract
    Ring oscillators (ROs) are widely used to study the degradation of logic CMOS circuits. To successfully link the time dependence of the ROs frequency degradation to the degradation of discrete device, we introduce a novel, fast wafer-level stress-and-sense methodology. With this new methodology, we unambiguously show the close correlation between discrete device degradation and circuit aging at typical wafer-level stress times.
  • Keywords
    CMOS logic circuits; ageing; oscillators; circuit aging; discrete device degradation; fast wafer-level stress-and-sense methodology; frequency degradation; logic CMOS circuits; ring oscillators; time dependence; wafer-level stress times; Degradation; Delays; Human computer interaction; Oscillators; Stress; Time-frequency analysis; Bias temperature instability (BTI); CMOS devices; hot-carrier injection (HCI); oscillator;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2015.2415414
  • Filename
    7089350