DocumentCode
34383
Title
Fast Wafer-Level Stress-and-Sense Methodology for Characterization of Ring-Oscillator Degradation in Advanced CMOS Technologies
Author
Kerber, Andreas ; Xinggong Wan ; Yang Liu ; Nigam, Tanya
Author_Institution
GLOBALFOUNDRIES, Inc., Malta, NY, USA
Volume
62
Issue
5
fYear
2015
fDate
May-15
Firstpage
1427
Lastpage
1432
Abstract
Ring oscillators (ROs) are widely used to study the degradation of logic CMOS circuits. To successfully link the time dependence of the ROs frequency degradation to the degradation of discrete device, we introduce a novel, fast wafer-level stress-and-sense methodology. With this new methodology, we unambiguously show the close correlation between discrete device degradation and circuit aging at typical wafer-level stress times.
Keywords
CMOS logic circuits; ageing; oscillators; circuit aging; discrete device degradation; fast wafer-level stress-and-sense methodology; frequency degradation; logic CMOS circuits; ring oscillators; time dependence; wafer-level stress times; Degradation; Delays; Human computer interaction; Oscillators; Stress; Time-frequency analysis; Bias temperature instability (BTI); CMOS devices; hot-carrier injection (HCI); oscillator;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2015.2415414
Filename
7089350
Link To Document