Abstract :
The following topics are dealt with: three-dimensional integrated circuits; large scale integration; electronic design automation; power distribution networks; through-silicon-vias; integrated circuit packaging; electromagnetic compatibility; flip-chip interconnects; and system-in-package.
Keywords :
electromagnetic compatibility; electronic design automation; flip-chip devices; integrated circuit interconnections; large scale integration; system-in-package; three-dimensional integrated circuits; 3D integrated circuits; electromagnetic compatibility; electronic design automation; flip-chip interconnects; integrated circuit packaging; large scale integration; power distribution networks; system-in-package; through-silicon-vias;
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-1444-2
Electronic_ISBN :
978-1-4673-1445-9
DOI :
10.1109/EDAPS.2012.6469446
