Title :
Effect of Al2O3 ALD nanocoatings on the thermo-mechanical behavior of Au/Si MEMS structures
Author :
Gall, Ken ; Dunn, Martin L. ; Hulse, Michael ; Finch, Dudley ; George, Steven M.
Author_Institution :
Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA
fDate :
30 March-4 April 2003
Abstract :
In the present study we examine the effect of different thermal hold temperatures on creep and stress relaxation during the first thermal cycle and the effect of maximum cycling temperature on thermal ratcheting. We also explore the use of Atomic Layer Deposition (ALD) Al2O3 nanocoatings for the potential suppression of creep and thermal ratcheting. High-resolution Scanning Electron Microscopy (SEM) is employed to examine surface microstructural changes induced by thermal holding or cycling with and without ALD nanocoatings.
Keywords :
CVD coatings; alumina; creep; gold; micromechanical devices; scanning electron microscopy; semiconductor device reliability; silicon; stress relaxation; surface structure; thermal stresses; 75 to 225 C; Al2O3; Al2O3 ALD nanocoatings; Au-Si; Au/Si MEMS structures; atomic layer deposition; creep; high-resolution scanning electron microscopy; maximum cycling temperature; stress relaxation; surface microstructural changes; thermal hold temperature; thermal ratcheting; thermo-mechanical behavior; Biological materials; Gold; Micromechanical devices; Nonhomogeneous media; Optical materials; Substrates; Temperature; Thermal stresses; Thermomechanical processes; Transistors;
Conference_Titel :
Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International
Print_ISBN :
0-7803-7649-8
DOI :
10.1109/RELPHY.2003.1197793
