Reliability testing the die-attach of CPV cell assemblies

Results and progress are reported for a course of work to establish an efficient reliability test for the die-attach of CPV cell assemblies. Test vehicle design consists of a ~1 cm² multijunction cell attached to a substrate via several processes. A thermal cycling sequence is developed in a test-to-failure protocol. Methods of detecting a failed or failing joint are prerequisite for this work; therefore both in-situ and non-destructive methods, including infrared imaging techniques, are being explored as a method to quickly detect non-ideal or failing bonds.