The life prediction of lead-free solder joint with type-I interval censored data

Author

Jinhua Mi ; Jie Wang ; Yan-Feng Li ; Hong-Zhong Huang ; Yuan-Jian Yang ; Weiwen Peng

Author_Institution

Sch. of Mech., Electron., & Ind. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China

fYear

2013

fDate

15-18 July 2013

Firstpage

904

Lastpage

907

Abstract

By collecting the data from thermal cycling test of an lead-free BGA interconnection structure, using type-I interval censored data processing method and modified Emgelmaier fatigue life model, the cycles to failure of lead-free solder joint are predicted. The comparison between the results obtained by proposed methods and the life calculated by Matlab verifies the practicability and effectiveness of the two methods.

Keywords

RoHS compliance; ball grid arrays; ductility; electronics industry; failure analysis; fatigue; integrated circuit interconnections; life testing; shear strength; solders; thermal analysis; Matlab; RoHS; failure; lead-free BGA interconnection structure; lead-free solder joint; life prediction; modified Emgelmaier fatigue life model; modified fatigue ductility exponent; shear strain; thermal cycling test; type-I interval censored data processing method; Data models; Data processing; Fatigue; Lead; Mathematical model; Reliability; Soldering; fatigue life prediction; lead-free solider joint; thermal cycling test; type-I interval censored data;

fLanguage

English

Publisher

ieee

Conference_Titel

Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE), 2013 International Conference on

Conference_Location

Chengdu

Print_ISBN

978-1-4799-1014-4

Type

conf

DOI

10.1109/QR2MSE.2013.6625714

Filename

6625714