Title :
The life prediction of lead-free solder joint with type-I interval censored data
Author :
Jinhua Mi ; Jie Wang ; Yan-Feng Li ; Hong-Zhong Huang ; Yuan-Jian Yang ; Weiwen Peng
Author_Institution :
Sch. of Mech., Electron., & Ind. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Abstract :
By collecting the data from thermal cycling test of an lead-free BGA interconnection structure, using type-I interval censored data processing method and modified Emgelmaier fatigue life model, the cycles to failure of lead-free solder joint are predicted. The comparison between the results obtained by proposed methods and the life calculated by Matlab verifies the practicability and effectiveness of the two methods.
Keywords :
RoHS compliance; ball grid arrays; ductility; electronics industry; failure analysis; fatigue; integrated circuit interconnections; life testing; shear strength; solders; thermal analysis; Matlab; RoHS; failure; lead-free BGA interconnection structure; lead-free solder joint; life prediction; modified Emgelmaier fatigue life model; modified fatigue ductility exponent; shear strain; thermal cycling test; type-I interval censored data processing method; Data models; Data processing; Fatigue; Lead; Mathematical model; Reliability; Soldering; fatigue life prediction; lead-free solider joint; thermal cycling test; type-I interval censored data;
Conference_Titel :
Quality, Reliability, Risk, Maintenance, and Safety Engineering (QR2MSE), 2013 International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4799-1014-4
DOI :
10.1109/QR2MSE.2013.6625714
