DocumentCode :
343863
Title :
Interconnect and packaging electrical circuits network
Author :
Gongo, R.S.N. ; Aubert, H. ; Baudrand, H. ; Lalaurie, J. ; Martins, G.
Author_Institution :
ENSEEIHT, Toulouse, France
Volume :
2
fYear :
1999
fDate :
11-16 July 1999
Firstpage :
974
Abstract :
With the emphasis on a multimodal variational approach in resonant transverse theory, a rigorous method for deriving equivalent electrical circuits are proposed for modeling the connection of planar transmission lines taking into account the shielding effects. The proposed electrical circuits have been implanted in the available CAD circuit with huge success and allows accurate prediction of the planar discontinuities behavior.
Keywords :
electromagnetic shielding; equivalent circuits; interconnections; packaging; transmission lines; variational techniques; CAD circuit; circuit interconnection; circuit packaging; electrical circuits network; equivalent electrical circuits; multimodal variational approach; planar discontinuities behavior; planar transmission lines; planar transmission lines connection; resonant transverse theory; shielding effects; Admittance; Apertures; Equivalent circuits; Integrated circuit interconnections; Microwave integrated circuits; Packaging; Planar transmission lines; RLC circuits; Resonance; Transmission line discontinuities;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Antennas and Propagation Society International Symposium, 1999. IEEE
Conference_Location :
Orlando, FL, USA
Print_ISBN :
0-7803-5639-x
Type :
conf
DOI :
10.1109/APS.1999.789475
Filename :
789475
Link To Document :
بازگشت