Distribution of intravascular and extravascular extracellular volume fractions for neovascularization assessment by dynamic contrast-enhanced magnetic resonance imaging

Author

Yi Sun ; Ze Ye

Author_Institution

Dept. of Electr. Eng., City Univ. of New York, New York, NY, USA

fYear

2012

fDate

1-1 Dec. 2012

Firstpage

1

Lastpage

6

Abstract

This study proposes and investigates the distribution of intravascular and extravascular extracellular volume fractions (DIEEF) as a noninvasive biomarker for neovascularization assessment by DCE-MRI. Two estimation methods without knowing the artery input function are developed. The mean square error of DIEEF estimate in the presence of noise and incomplete data is analyzed. Simulation result shows that DIEEF can be accurately estimated even when signal to noise ratio is as low as 5 dB. Tested on a model of atherosclerotic rabbits, DIEEF of aorta plaques is positively correlated with the histological neovessel count with correlation coefficient of 0.940 and P-value of 0.017 and outperforms six existing semiquantitative parameters.

Keywords

biomedical MRI; blood vessels; cellular biophysics; correlation methods; data analysis; diseases; estimation theory; image sequences; mean square error methods; medical image processing; MRI; aorta plaques; artery input function; atherosclerotic rabbits; correlation coefficient; data analysis; dynamic contrast-enhanced magnetic resonance imaging; estimation methods; extravascular extracellular volume fraction distribution; histological neovessel count; image sequences; intravascular extracellular volume fraction distribution; mean square error; neovascularization assessment; noninvasive biomarker; semiquantitative parameters; signal-noise ratio; Atherosclerosis; Estimation; Extracellular; Magnetic resonance imaging; Rabbits; Signal to noise ratio; DCE-MRI; atherosclerosis; biomarker; pharmacokinetics; tumor;

fLanguage

English

Publisher

ieee

Conference_Titel

Signal Processing in Medicine and Biology Symposium (SPMB), 2012 IEEE

Conference_Location

New York, NY

Print_ISBN

978-1-4673-5665-7

Type

conf

DOI

10.1109/SPMB.2012.6469466

Filename

6469466