DocumentCode
3438696
Title
Test structures on MCM active substrate: is it worthwhile?
Author
Oliver ; Kerkhoff
Author_Institution
CNM-IMB, Univ. Autonoma de Barcelona, Spain
fYear
1996
fDate
11-14 Mar 1996
Firstpage
126
Lastpage
130
Abstract
The miniaturization of electronic systems in areas such as electronic integration and electronic packaging allows the inclusion of devices on reduced substrates constituting a MultiChip Module (MCM). However, with the miniaturization of microsystems big troubles appear in the testing of the MCM. In order to solve the MCM test problem, this paper analyses the cost of using test structures on MCM-Deposited active substrates. Cost results are obtained from yield calculations of test structures placed on active substrate
Keywords
automatic testing; boundary scan testing; circuit optimisation; fault diagnosis; integrated circuit yield; multichip modules; MCM; active substrate; electronic packaging; test structures; yield calculations; Automatic testing; Circuit faults; Costs; Electronics packaging; Integrated circuit interconnections; Integrated circuit manufacture; Integrated circuit packaging; Multichip modules; Performance evaluation; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
European Design and Test Conference, 1996. ED&TC 96. Proceedings
Conference_Location
Paris
ISSN
1066-1409
Print_ISBN
0-8186-7424-5
Type
conf
DOI
10.1109/EDTC.1996.494137
Filename
494137
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