Consistency of optical data from PICA

Author

Lundquist, T. ; Le Coupanec, P. ; Abraham, A. ; Ng, W.

fYear

2003

fDate

30 March-4 April 2003

Firstpage

564

Lastpage

569

Abstract

This paper reports on an investigation of optical waveform "signatures" available from PICA. PICA collects photon emission data in time and space (t, x, y) simultaneously from all transistors in its 160 μm field of view. This data if consistent can be used to determine process uniformity, non-catastrophic failures and degradation of transistors during reliability testing by comparing transistor optical waveform "signatures". As PICA is essentially a remote sensing technique it may predict failures early-on and thus accelerate reliability testing. Therefore, we have also investigated to see if this is observed.

Keywords

CMOS integrated circuits; MOSFET; electroluminescence; failure analysis; hot carriers; integrated circuit reliability; overvoltage; semiconductor device reliability; semiconductor device testing; CMOS transistors; PICA; early failure prediction; hot carrier induced light emission; noncatastrophic failures; optical data consistency; optical waveform signatures; overvoltage stressing; photon emission data; picosecond imaging circuit analysis; process uniformity; reliability testing; remote sensing technique; transistor degradation; Cameras; Circuit testing; Degradation; Hot carriers; Optical saturation; Optical sensors; Stimulated emission; Switches; Time measurement; Timing;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium Proceedings, 2003. 41st Annual. 2003 IEEE International

Print_ISBN

0-7803-7649-8

Type

conf

DOI

10.1109/RELPHY.2003.1197809

Filename

1197809