DocumentCode :
3439136
Title :
Fluorinated Heterocyclic Polyimides for Potential Use in RF MEMS Devices
Author :
Bruma, M. ; Sava, I. ; Hamciuc, E. ; Buiculescu, C.
Author_Institution :
"Petru Poni" Inst. of Macromolecular Chem., Iasi
Volume :
2
fYear :
2007
fDate :
Oct. 15 2007-Sept. 17 2007
Firstpage :
361
Lastpage :
364
Abstract :
A series of fluorinated polyimides containing oxadiazole rings and hexafluoroisopropylidene groups in the main chain were prepared by polycondensation in solution at high temperature of hexafluoroisopropylidene diphthalic dianhydride with aromatic diamines containing preformed oxadiazole ring. These polymers are soluble in polar aprotic solvents and show remarkable film-forming ability. The free standing films exhibit low dielectric constant and strong adhesion to various substrates. The polymers are highly thermostable with decomposition temperature being above 470degC and glass transition above 220degC. All these properties make the present polymers potential candidates for applications as high performance materials.
Keywords :
adhesion; condensation; glass transition; high-temperature effects; micromechanical devices; permittivity; polymer films; RF MEMS devices; adhesion; aromatic diamines; decomposition temperature; dielectric constant; film-forming ability; fluorinated heterocyclic polyimides; glass transition; hexafluoroisopropylidene diphthalic dianhydride; high temperature effects; polycondensation; Adhesives; Dielectric constant; Dielectric materials; Dielectric substrates; Glass; Polyimides; Polymer films; Radiofrequency microelectromechanical systems; Solvents; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference, 2007. CAS 2007. International
Conference_Location :
Sinaia
ISSN :
1545-827X
Print_ISBN :
978-1-4244-0847-4
Type :
conf
DOI :
10.1109/SMICND.2007.4519735
Filename :
4519735
Link To Document :
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