• DocumentCode
    3439136
  • Title

    Fluorinated Heterocyclic Polyimides for Potential Use in RF MEMS Devices

  • Author

    Bruma, M. ; Sava, I. ; Hamciuc, E. ; Buiculescu, C.

  • Author_Institution
    "Petru Poni" Inst. of Macromolecular Chem., Iasi
  • Volume
    2
  • fYear
    2007
  • fDate
    Oct. 15 2007-Sept. 17 2007
  • Firstpage
    361
  • Lastpage
    364
  • Abstract
    A series of fluorinated polyimides containing oxadiazole rings and hexafluoroisopropylidene groups in the main chain were prepared by polycondensation in solution at high temperature of hexafluoroisopropylidene diphthalic dianhydride with aromatic diamines containing preformed oxadiazole ring. These polymers are soluble in polar aprotic solvents and show remarkable film-forming ability. The free standing films exhibit low dielectric constant and strong adhesion to various substrates. The polymers are highly thermostable with decomposition temperature being above 470degC and glass transition above 220degC. All these properties make the present polymers potential candidates for applications as high performance materials.
  • Keywords
    adhesion; condensation; glass transition; high-temperature effects; micromechanical devices; permittivity; polymer films; RF MEMS devices; adhesion; aromatic diamines; decomposition temperature; dielectric constant; film-forming ability; fluorinated heterocyclic polyimides; glass transition; hexafluoroisopropylidene diphthalic dianhydride; high temperature effects; polycondensation; Adhesives; Dielectric constant; Dielectric materials; Dielectric substrates; Glass; Polyimides; Polymer films; Radiofrequency microelectromechanical systems; Solvents; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Conference, 2007. CAS 2007. International
  • Conference_Location
    Sinaia
  • ISSN
    1545-827X
  • Print_ISBN
    978-1-4244-0847-4
  • Type

    conf

  • DOI
    10.1109/SMICND.2007.4519735
  • Filename
    4519735