Reliability simulation analysis method based on stress-damage model of electronic product

The root reason for the failure of an electronic product is that the mechanical, thermal, electronic and other environmental loadings will lead to the local damage and induce its ultimate failure, this process can be described quantitatively by stress-damage model. This paper put forward a new reliability simulation analysis method based on stress-damage model, and the method regards the Physics-of-Failure reliability theory as its theoretical principle. The common board-level stress-damage models and device-level stress-damage models of electronic products are introduced, then the reliability simulation analysis method is described in detail, the design information and the expected work environment of the product are used as its input, the thermal, vibration and electrical stress characteristics are analyzed by modeling and simulation methods, damage analysis is conducted using stress-damage model and the failure information matrix including failure location, failure mode, failure mechanism and time to failure can be obtained finally. This method can focus on the underlying failure cause to find the reliability design weak problems, and provide valuable information to mend the design, thus to improve the inherent reliability of electronic products.