DocumentCode :
3439622
Title :
A global chip test implementation including built-in self-test
Author :
Erdal, A.C. ; Uszynski, Pierre A.
Author_Institution :
Signetics, Sunnyvale, CA, USA
fYear :
1988
fDate :
3-5 Oct 1988
Firstpage :
446
Lastpage :
449
Abstract :
The authors describe a systematic global test strategy and its implementation into a CMOS VLSI chip. Features include built-in self-test (BIST), embedded scan path, and boundary scan path for chip and board testability and diagnostics. The BIST implementation was derived from the sliding parity response compaction scheme and the boundary scan scheme was developed following the Joint Test Action Group Standard. The BIST method allows a systematic self-test design in a cell-based IC design methodology with a very high fault coverage in a very short test time. Critical parameters such as fault coverage, area overhead, performance degradation, and testing time are also reported
Keywords :
CMOS integrated circuits; VLSI; automatic testing; circuit CAD; integrated circuit testing; CMOS VLSI chip; area overhead; boundary scan path; built-in self-test; embedded scan path; fault coverage; global chip test implementation; performance degradation; Automatic testing; Built-in self-test; Circuit testing; Compaction; Flip-flops; Logic testing; Production; Registers; System testing; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Design: VLSI in Computers and Processors, 1988. ICCD '88., Proceedings of the 1988 IEEE International Conference on
Conference_Location :
Rye Brook, NY
Print_ISBN :
0-8186-0872-2
Type :
conf
DOI :
10.1109/ICCD.1988.25740
Filename :
25740
Link To Document :
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