DocumentCode
3439654
Title
The Voltage Dependence of Reverse Current of Semiconductor PN Junctions and its Distribution over the Device Area
Author
Obreja, Vasile V N
Author_Institution
Nat. R&D Inst. for Microtechnol., Bucharest
Volume
2
fYear
2007
fDate
Oct. 15 2007-Sept. 17 2007
Firstpage
485
Lastpage
488
Abstract
Experimental electrical characteristics at room and high temperature are presented for germanium, silicon and silicon carbide PN junction diodes. Linear voltage dependence of reverse current is exhibited for a portion of electrical characteristic if plots in linear-linear scales are considered. At higher applied voltage, deviation from the linear dependence is usually exhibited. In the case of germanium diodes and silicon diodes, existing experimental evidence indicates that such behavior is possible when most of reverse current flows at the junction edge. In the case of silicon carbide PN junctions similar behavior suggests that significant reverse current may flow at the junction edge.
Keywords
elemental semiconductors; germanium; leakage currents; p-n junctions; semiconductor device breakdown; semiconductor diodes; silicon; silicon compounds; wide band gap semiconductors; Ge; Si; SiC; electrical characteristics; germanium PN junction diodes; linear voltage dependence; linear-linear scales; reverse current; semiconductor PN junctions; silicon PN junction diodes; silicon carbide PN junction diodes; Avalanche breakdown; Breakdown voltage; Electric variables; Germanium; Leakage current; Passivation; Semiconductor diodes; Silicon carbide; Temperature; Virtual reality; PN junction edge; breakdown voltage; electrical characteristic; reverse leakage current;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference, 2007. CAS 2007. International
Conference_Location
Sinaia
ISSN
1545-827X
Print_ISBN
978-1-4244-0847-4
Type
conf
DOI
10.1109/SMICND.2007.4519766
Filename
4519766
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