Title :
Analysis of ground bond wire arrays for RFICs
Author_Institution :
Motorola Inc., Tempe, AZ, USA
Abstract :
This paper outlines a method for rapid computation of the inductance of arrays of ground bond wires for RFICs, thus saving a designer considerable time over using inaccurate empirical equations or slowly converging electromagnetic simulators. Results comparable in accuracy to a fully derailed PEEC electromagnetic simulation are shown.
Keywords :
UHF integrated circuits; inductance; integrated circuit packaging; lead bonding; RFIC; ground bond wire arrays; inductance computation; Bonding; Circuit simulation; Computational modeling; Electromagnetic induction; Equations; Geometry; Inductance; Packaging; Radiofrequency integrated circuits; Wire;
Conference_Titel :
Microwave Symposium Digest, 1997., IEEE MTT-S International
Conference_Location :
Denver, CO, USA
Print_ISBN :
0-7803-3814-6
DOI :
10.1109/MWSYM.1997.602902
